New Innovative Way to Functionally Verify Heterogeneous 2D/3D Package Connectivity
The heterogeneous integration of multiple ICs in a single package along with high-performance, high bandwidth memory is critical for many high-performance computing applications. After everything has been heterogeneously integrated and packaged, such designs feature complex connectivity with many hundreds of thousands of connections, making it extremely challenging to verify the correctness of the connections.
Full-access members only
Register your account to view New Innovative Way to Functionally Verify Heterogeneous 2D/3D Package Connectivity
Full-access members gain access to our free tools and training, including our full library of articles, recorded sessions, seminars, papers, learning tracks, in-depth verification cookbooks, and more.