The OVM/UVM Booth at DAC 2010 had a large number of visitors present to meet with OVM and UVM experts, share best use practices and learn current status of OVM and UVM. The full set of slide presentations can now be found here on OVM World.
Each day featured an OVM/UVM update that gave a brief history on OVM and UVM, a report on the UVM Early Adopter kit that was released for trial use purposes along with a status update on Accellera VIP-TSC committee work underway to complete the first version of the official standard.
The following list shows the presentations by OVM ecosystem partners and users at DAC 2010.
- Agnisys: Agile Methods for Verification
- Agnisys: Automatic Generation of OVM/UVM Registers
- Duolog: Verification Productivity - Introducing and Eliminating the GNAT
- Duolog: AEIOU (VM) Any Vowel Will Do
- Doulos:The Communication and Customization Mechanisms in OVM and UVM
- InSys: SuperSpeed your USB 3.0 Verification with OVM based nSys Verification IP
- SiBridge: Successful OVM Deployment
- Silicon Interfaces: Release Gigabit Ethernet MAC to Industry with Zero Defect Guarantee
- TSMC: ESL to RTL Verification Progressive Refinement & Reuse Paradigm
- Verilab: Simulation-Based FlexRayTM 3.0 Conformance Testing
With Accellera’s release of the UVM 1.0 E.A. kit for industry trial use, OVM World has split the technical topic forums into two parts. One is for ongoing OVM conversations at the Main OVM Forum and the second is for UVM conversations at the Main UVM Forum. Issues that are found with UVM will be shared with the Accellera Verification Intellectual Property (VIP) Technical Subcommittee (TSC) (www.accellera.org/activities/vip) to ensure any user issues or needed enhancements can be part of the official standard expected to be approved late 2010 or early 2011.